Some common sense about vacuum coating processing


Release time:

2022-08-26

Vacuum Coating Processing Manufacturer: Vacuum coating technology is one of the methods of gas phase deposition, also known as vacuum electroplating. Under vacuum conditions, the coating material is heated and sublimated by an evaporator, and the evaporated particles directly flow to the substrate, depositing a solid thin film on the surface of the substrate. Vacuum coating is widely used, such as vacuum aluminum plating, vacuum coating on plastic and other substrates, and then dyeing different colors. It can be used to manufacture furniture, crafts, lamps, clocks, toys, car lights, mirrors and flexible packaging materials, with good decorative effects.

 

   Vacuum Coating Processing Manufacturer: Vacuum coating technology is one of the methods of vapor deposition, also known as vacuum electroplating. Under vacuum conditions, the coating material is heated and sublimated by an evaporator, and the evaporated particles flow directly to the substrate, depositing a solid thin film on the substrate surface. Vacuum coating is widely used, such as vacuum aluminum plating, vacuum coating on substrates such as plastics, and then dyeing different colors. It can be used to manufacture furniture, crafts, lamps, watches, toys, car lights, mirrors and flexible packaging materials, with excellent decorative effects. Vacuum-coated products have advantages such as high brightness, delicate and realistic texture, low manufacturing cost, environmental protection, and less substrate limitation, and are increasingly used in the surface treatment of cosmetic casings.

 

  Vacuum Coating Processing Manufacturer: The process of vacuum coating is simply that electrons accelerate towards the substrate under the action of an electric field and collide with argon atoms, and a large number of argon ions and electrons are ionized, and the electrons fly towards the substrate. Under the action of the electric field, argon ions accelerate and bombard the target material, sputtering a large number of target material atoms, and neutral target material atoms (or molecules) deposit on the substrate to form a thin film.

       

  Vacuum Coating Processing Manufacturer: In a practical DC sputtering system, it is difficult to maintain self-sustaining discharge under conditions below 1.3 Pa, because there are not enough ionization collisions under such conditions. Therefore, improving the ionization collisions of sputtering systems operating at pressures below 1.3~2.7 Pa is particularly important. Methods for improving ionization collisions rely on additional electron sources, rather than secondary electrons emitted from the cathode. Using high-frequency discharge devices or applying a magnetic field to improve the ionization efficiency of existing electrons.

 

  Vacuum Coating Processing Manufacturer: In vacuum coating, secondary electrons, when accelerating towards the substrate, are confined to the plasma region near the target surface under the influence of the Lorentz force of the magnetic field. The plasma density in this region is very high, and the secondary electrons move around the target surface under the action of the magnetic field. The electron's path is very long. During the movement, they continuously collide with argon atoms, ionizing a large number of argon ions to bombard the target. After multiple collisions, the energy of the electrons gradually decreases, breaking free from the magnetic field lines and moving away from the target.

 

   Vacuum Coating Processing Manufacturer: Vacuum coating extends the electron's path by using a magnetic field, changes the electron's direction of motion, improves the ionization rate of the working gas, and effectively utilizes the electron's energy. The destination of electrons is not only the substrate, but also the inner wall of the vacuum chamber and the target source anode, because the substrate, vacuum chamber, and anode are usually at the same potential. The interaction with the electric field causes the trajectory of a single electron to spiral in three-dimensional space, rather than simply moving around the target surface.


 

 

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